Koch Chemie – Micro Cut Pads – Purple

Koch Chemie Micro Cut Buffing Pads use high-quality special sponge for removing fine scratches, holograms and polishing marks, using the Micro Cut M3.02 Fine Polishing Compound. The short height of 23 mm creates low torsion forces, very good handling and the highest level of stability. The special density of the foam material enables long-lasting compression hardness during polishing. The optimised reticulation (open cellular structure) and cell count contribute to a high-shine finish and very good hygiene factors. The milling edge ensures extra flexibility for the pads, enabling them to fit around contours easier. The colourful non-woven material, suitable for polishing, ensures process safety.

Technical Specification:

• Depth: 23mm
• Construction: Reticulated (open cell)
• Abrasiveness: 5
• Compression Hardness:10